◆ High-performance
UV Laser Source: UV
Laser is a diode pumped laser source with high beam quality, high peak
power, short pulse duration and stable high power pulse, which is a "cold" process that ensures the stability of
cutting quality.
◆ Optimized Optical System: This system ensures processing accuracy with lower power consumption, smaller spot
size, higher beam quality, and supports autofocus function.
◆ Control System: High resolution linear gauge ensures the location
accuracy and repeatability
power, short pulse duration and stable high power pulse, which is a "cold" process that ensures the stability of
cutting quality.
◆ Optimized Optical System: This system ensures processing accuracy with lower power consumption, smaller spot
size, higher beam quality, and supports autofocus function.
◆ Control System: High resolution linear gauge ensures the location
accuracy and repeatability
.◆ Natural
Granite Platform: Natural
and massive granite base reduces the inertia vibration of the table during
start-up,
shut-down and acceleration. At the same time, it maintains temperature stability.
◆ Air Bearing Design: Air bearings are used due to their high precision, long-term stability, frictionless motion and easy
maintenance.
◆ Software: smart laser micromachining application platform, that is user-friendly, and supports most
industrial data formats.
shut-down and acceleration. At the same time, it maintains temperature stability.
◆ Air Bearing Design: Air bearings are used due to their high precision, long-term stability, frictionless motion and easy
maintenance.
◆ Software: smart laser micromachining application platform, that is user-friendly, and supports most
industrial data formats.
Application Range
◆ Drilling and de-panelizing flexible printed circuit board, rigid printed circuit board, flexible-rigid printed circuit board, and
chip substrate package.
◆ De-panelizing assembled flexible or rigid circuits.
◆ Precisely cutting and scribing ceramics with the thickness within 2.0mm.
◆ Precisely cutting thin copper foil, pressure sensitive adhesive, PP, acrylic sheet, polyimide film, etc.
◆ Precisely cutting ITO thin film, glass, organic thin film, special metal sheet, wafer and sapphire, etc.
◆ Support Roll to Roll Cutting way
◆ Drilling and de-panelizing flexible printed circuit board, rigid printed circuit board, flexible-rigid printed circuit board, and
chip substrate package.
◆ De-panelizing assembled flexible or rigid circuits.
◆ Precisely cutting and scribing ceramics with the thickness within 2.0mm.
◆ Precisely cutting thin copper foil, pressure sensitive adhesive, PP, acrylic sheet, polyimide film, etc.
◆ Precisely cutting ITO thin film, glass, organic thin film, special metal sheet, wafer and sapphire, etc.
◆ Support Roll to Roll Cutting way
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